EFFECTS OF HEAT-TREATING AU/NI THIN-FILM COMPOSITES IN VARIOUS AMBIENTS

被引：8

作者：

KURINEC, SK ^{[1
]}

TOOR, I ^{[1
]}

CHAO, YK ^{[1
]}

SHILLINGFORD, H ^{[1
]}

HOLLOWAY, P ^{[1
]}

RAY, S ^{[1
]}

BECKHAM, K ^{[1
]}

机构：

[1] IBM CORP,DIV GEN TECHNOL,HOPEWELL JUNCTION,NY 12533

来源：

THIN SOLID FILMS | 1988年 / 162卷 / 1-2期

关键词：

D O I：

10.1016/0040-6090(88)90212-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：247 / 255

页数：9

共 12 条

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[3] POROSITY IN THIN NI/AU METALLIZATION LAYERS [J].

CHAO, YK ;

KURINEC, SK ;

TOOR, I ;

SHILLINGFORD, H ;

HOLLOWAY, PH .

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[4]

ENGELL HJ, 1954, ACTA METALL, V2, P92

[5] DIFFUSION PROBLEMS IN MICRO-ELECTRONIC PACKAGING [J].

HALL, PM ;

MORABITO, JM .

THIN SOLID FILMS, 1978, 53 (02) :175-182

[6]

HANSEN M, 1958, CONSTITUTION BINARY, P220

[7] ANALYSIS OF GRAIN-BOUNDARY DIFFUSION IN THIN-FILMS - CHROMIUM IN GOLD [J].

HOLLOWAY, PH ;

AMOS, DE ;

NELSON, GC .

JOURNAL OF APPLIED PHYSICS, 1976, 47 (09) :3769-3775

[8]

MAYER JW, 1978, THIN FILM INTERDIFFU, P129

[9]

RHINES FN, 1977, J ELECTROCHEM SOC, V124, P1222

[10]

SWALIN RA, 1954, THERMODYNAMICS SOLID

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