DIFFUSION PROBLEMS IN MICRO-ELECTRONIC PACKAGING

[1] ABRAMOWITZ M, 1970, HDB MATH FUNCTIONS, P317

[2] BRONGERSMA HH, SURF SCI

[3] AUGER STUDIES OF AU DIFFUSION THROUGH PT FILMS - DEPENDENCE ON ANNEALING AMBIENT [J]. APPLIED PHYSICS LETTERS, 1976, 29 (08) : 453 - 454

[4] Condra L. W., 1977, 27th Electronic Components Conference, P135

[5] TERMINATION MATERIALS FOR THIN FILM RESISTORS [J]. PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10): : 1418 - &

[6] GANGULEE A, 1975, THIN SOLID FILMS, V25

[7] GERRITSEN AN, 1956, HDB PHYSIK, V19, P210

[8] METALLIZATION IN MICROELECTRONICS [J]. THIN SOLID FILMS, 1977, 45 (01) : 69 - 84

[9] GRAIN-BOUNDARY DIFFUSION IN THIN-FILMS .2. MULTIPLE GRAIN-BOUNDARIES AND SURFACE-DIFFUSION [J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (10) : 4373 - 4380

[10] COMPOSITIONAL DEPTH PROFILING BY AUGER-ELECTRON SPECTROSCOPY [J]. CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1978, 8 (01): : 53 - 67

[1] ABRAMOWITZ M, 1970, HDB MATH FUNCTIONS, P317

[2] BRONGERSMA HH, SURF SCI

[3] AUGER STUDIES OF AU DIFFUSION THROUGH PT FILMS - DEPENDENCE ON ANNEALING AMBIENT [J]. APPLIED PHYSICS LETTERS, 1976, 29 (08) : 453 - 454

[4] Condra L. W., 1977, 27th Electronic Components Conference, P135

[5] TERMINATION MATERIALS FOR THIN FILM RESISTORS [J]. PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10): : 1418 - &

[6] GANGULEE A, 1975, THIN SOLID FILMS, V25

[7] GERRITSEN AN, 1956, HDB PHYSIK, V19, P210

[8] METALLIZATION IN MICROELECTRONICS [J]. THIN SOLID FILMS, 1977, 45 (01) : 69 - 84

[9] GRAIN-BOUNDARY DIFFUSION IN THIN-FILMS .2. MULTIPLE GRAIN-BOUNDARIES AND SURFACE-DIFFUSION [J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (10) : 4373 - 4380

[10] COMPOSITIONAL DEPTH PROFILING BY AUGER-ELECTRON SPECTROSCOPY [J]. CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1978, 8 (01): : 53 - 67