FEATURE SIZE AND TEMPERATURE SENSITIVE PROCESS WINDOWS FOR EXCIMER LASER PLANARIZATION OF ALUMINUM

[1] BASEMAN RJ, 1988, SELECTED TOPICS E EA, V18, P259

[2] BASEMAN RJ, UNPUB

[3] BERNHARDT AF, 1989, IN PRESS MATER RES S, V129

[4] Broadbent E. K., 1989, 1989 Proceedings. Sixth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.89TH0259-2), P336, DOI 10.1109/VMIC.1989.77993

[5] Liu R., 1989, 1989 Proceedings. Sixth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.89TH0259-2), P329, DOI 10.1109/VMIC.1989.77992

[6] MODELING OF LASER PLANARIZATION OF THIN METAL-FILMS [J]. APPLIED PHYSICS LETTERS, 1989, 54 (12) : 1109 - 1111

[7] MARELLA PF, 1989, IN PRESS MATER RES S, V129

[8] Mukai R., 1988, 1988 Proceedings. Fifth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.88CH2624-5), P101, DOI 10.1109/VMIC.1988.14181

[9] HIGH-ASPECT-RATIO VIA-HOLE FILLING WITH ALUMINUM MELTING BY EXCIMER LASER IRRADIATION FOR MULTILEVEL INTERCONNECTION [J]. IEEE ELECTRON DEVICE LETTERS, 1987, 8 (02) : 76 - 78

[10] MUKAI R, 1987, MATER RES SOC S P, V74, P229

[1] BASEMAN RJ, 1988, SELECTED TOPICS E EA, V18, P259

[2] BASEMAN RJ, UNPUB

[3] BERNHARDT AF, 1989, IN PRESS MATER RES S, V129

[4] Broadbent E. K., 1989, 1989 Proceedings. Sixth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.89TH0259-2), P336, DOI 10.1109/VMIC.1989.77993

[5] Liu R., 1989, 1989 Proceedings. Sixth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.89TH0259-2), P329, DOI 10.1109/VMIC.1989.77992

[6] MODELING OF LASER PLANARIZATION OF THIN METAL-FILMS [J]. APPLIED PHYSICS LETTERS, 1989, 54 (12) : 1109 - 1111

[7] MARELLA PF, 1989, IN PRESS MATER RES S, V129

[8] Mukai R., 1988, 1988 Proceedings. Fifth International IEEE VLSI Multilevel Interconnection Conference (Cat. No.88CH2624-5), P101, DOI 10.1109/VMIC.1988.14181

[9] HIGH-ASPECT-RATIO VIA-HOLE FILLING WITH ALUMINUM MELTING BY EXCIMER LASER IRRADIATION FOR MULTILEVEL INTERCONNECTION [J]. IEEE ELECTRON DEVICE LETTERS, 1987, 8 (02) : 76 - 78

[10] MUKAI R, 1987, MATER RES SOC S P, V74, P229