QUANTITATIVE-EVALUATION OF GATE OXIDE DAMAGE DURING PLASMA PROCESSING USING ANTENNA-STRUCTURE CAPACITORS

被引:38
作者
ERIGUCHI, K
URAOKA, Y
NAKAGAWA, H
TAMAKI, T
KUBOTA, M
NOMURA, N
机构
[1] Semiconductor Research Center, Matsushita Electric Industrial Co., Ltd., Moriguchi, Osaka
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1994年 / 33卷 / 1A期
关键词
GATE OXIDE DAMAGE; ANTENNA EFFECT; POLYSILICON; CHARGE-TO-BREAKDOWN; DRY ETCHING; FOWLER-NORDHEIM CURRENT;
D O I
10.1143/JJAP.33.83
中图分类号
O59 [应用物理学];
学科分类号
摘要
Plasma-induced damage of gate oxides is evaluated from the difference between the intrinsic charge-to-breakdown (Q(BD)) and the residual Q(BD) This difference, Delta Q(BD), corresponds to the plasma-induced damage to the oxide and to the accumulation of conduction current from the plasma into the oxide. It is shown experimentally that the plasma-induced damage Delta Q(BD) increases in proportion to the antenna ratio (exposed antenna area/gate area). The Delta Q(BD) Of the antenna capacitor depends not on the device structures such as the gate oxide thickness, but on the plasma process conditions.
引用
收藏
页码:83 / 87
页数:5
相关论文
共 12 条
[1]  
ERIGUCHI K, 40TH SPRING M JAP SO
[2]  
ERIGUCHI K, 1992, 43RD P S SEMIC INT C, P42
[3]   MAGNETRON ETCHING OF POLYSILICON - ELECTRICAL DAMAGE [J].
GREENE, WM ;
KRUGER, JB ;
KOOI, G .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (02) :366-369
[4]  
HASHIMOTO K, 1991, 13TH P S DRY PROC TO, P93
[5]  
KUBOTA T, 1992, 1992 ECS SPRING M PR, P424
[6]  
Liang M.-S., 1984, International Electron Devices Meeting. Technical Digest (Cat. No. 84CH2099-0), P152
[7]  
MACHIDA K, 1992, 5TH P MICR C, P138
[8]  
MOSLEHI MM, 1984, 1984 INT EL DEV M PH, P157
[9]  
REMBETSKI JF, 1992, 1992 DRY PROC S, P27
[10]   DEPENDENCE OF PLASMA-INDUCED OXIDE CHARGING CURRENT ON AL ANTENNA GEOMETRY [J].
SHIN, H ;
HU, CM .
IEEE ELECTRON DEVICE LETTERS, 1992, 13 (12) :600-602