PERFORMANCE OF NEW COPPER BASED METALLIZATION SYSTEMS IN AN 85-DEGREEC 80-PERCENT RHCL2 CONTAMINATED ENVIRONMENT

被引：15

作者：

SBAR, NL ^{[1
]}

FEINSTEIN, LG ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1977年 / 13卷 / 03期

关键词：

D O I：

10.1109/TPHP.1977.1135194

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：208 / 218

页数：11

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