LOW-TEMPERATURE CONDUCTION AND BREAKDOWN PHENOMENA IN AU-SIO-CHI-AU THIN-FILM SANDWICH STRUCTURES

被引：25

作者：

GOULD, RD ^{[1
]}

HOGARTH, CA ^{[1
]}

机构：

[1] BRUNEL UNIV, DEPT PHYS, UXBRIDGE, MIDDLESEX, ENGLAND

来源：

INTERNATIONAL JOURNAL OF ELECTRONICS | 1975年 / 38卷 / 05期

关键词：

D O I：

10.1080/00207217508920431

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：577 / 591

页数：15

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