INFLUENCE OF DEPOSITION RATES AND THICKNESS ON THE ELECTRICAL-RESISTIVITY AND THERMOELECTRIC-POWER OF THIN IRON FILMS

被引：10

作者：

SCHEPIS, RS

MATIENZO, LJ

EMMI, F

UNERTL, W

SCHRODER, K

机构：

[1] SYRACUSE UNIV,DEPT CHEM ENGN & MAT SCI,SYRACUSE,NY 13244

[2] UNIV MAINE,DEPT PHYS & ASTRON,ORONO,ME 04469

来源：

THIN SOLID FILMS | 1994年 / 251卷 / 02期

关键词：

DEPOSITION PROCESS; ELECTRICAL PROPERTIES AND MEASUREMENTS; IRON;

D O I：

10.1016/0040-6090(94)90671-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The electrical resistance and the thermopower of thin iron films were measured near room temperature as a function of deposition rate and thickness. The films were deposited on glass plates in a high vacuum system at pressures in the region of 10(-7) Torr. Deviations of the resistivity and the Seebeck coefficient from bulk values increased with decreasing deposition rates.

引用

页码：99 / 102

页数：4

共 9 条

[1]

ELSAYED A, 1987, J APPL PHYS, V61, P4273

[2] The conductivity of thin metallic films according to the electron theory of metals [J].