INFLUENCE OF DEPOSITION RATES AND THICKNESS ON THE ELECTRICAL-RESISTIVITY AND THERMOELECTRIC-POWER OF THIN IRON FILMS

被引:10
作者
SCHEPIS, RS
MATIENZO, LJ
EMMI, F
UNERTL, W
SCHRODER, K
机构
[1] SYRACUSE UNIV,DEPT CHEM ENGN & MAT SCI,SYRACUSE,NY 13244
[2] UNIV MAINE,DEPT PHYS & ASTRON,ORONO,ME 04469
关键词
DEPOSITION PROCESS; ELECTRICAL PROPERTIES AND MEASUREMENTS; IRON;
D O I
10.1016/0040-6090(94)90671-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The electrical resistance and the thermopower of thin iron films were measured near room temperature as a function of deposition rate and thickness. The films were deposited on glass plates in a high vacuum system at pressures in the region of 10(-7) Torr. Deviations of the resistivity and the Seebeck coefficient from bulk values increased with decreasing deposition rates.
引用
收藏
页码:99 / 102
页数:4
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