NATURAL-CONVECTION HEAT-TRANSFER CHARACTERISTICS OF SIMULATED MICROELECTRONIC CHIPS

被引：42

作者：

PARK, KA

BERGLES, AE

机构：

来源：

JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME | 1987年 / 109卷 / 01期

关键词：

D O I：

10.1115/1.3248074

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

引用

页码：90 / 96

页数：7

共 40 条

[1] LIQUID IMMERSION COOLING OF SMALL ELECTRONIC DEVICES [J].

BAKER, E .

MICROELECTRONICS AND RELIABILITY, 1973, 12 (02) :163-173

BAKER, E .

MICROELECTRONICS AND RELIABILITY, 1972, 11 (02) :213-&

BRODOWICZ, K .

CAREY, VP ;

MOLLENDORF, JC .

CHURCHILL, SW ;

USAGI, R .

[6]

Ede A.J., 1967, ADV FREE CONVECTION, P1

[7]

EICHHORN R, 1962, INT J HEAT MASS TRAN, V5, P915

FUJII, T ;

IMURA, H .

[9]

FUJII T, 1976, INT J HEAT MASS TRAN, V19, P121, DOI 10.1016/0017-9310(76)90020-X

[10]

Goldstein R.J., 1960, Int. J. Heat Mass Transfer, V1, P208, DOI DOI 10.1016/0017-9310(60)90023-5