THERMAL-STABILITY OF HAFNIUM AND TITANIUM NITRIDE DIFFUSION-BARRIERS IN MULTILAYER CONTACTS TO SILICON

被引:82
作者
SUNI, I [1 ]
MAENPAA, M [1 ]
NICOLET, MA [1 ]
LUOMAJARVI, M [1 ]
机构
[1] UNIV HELSINKI,DEPT PHYS,SF-00170 HELSINKI 17,FINLAND
关键词
D O I
10.1149/1.2119920
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:1215 / 1218
页数:4
相关论文
共 17 条
[1]   DIFFUSION OF COPPER IN THIN TIN FILMS [J].
CHAMBERLAIN, MB .
THIN SOLID FILMS, 1982, 91 (02) :155-162
[2]   THERMAL-STABILITY OF TITANIUM NITRIDE FOR SHALLOW JUNCTION SOLAR-CELL CONTACTS [J].
CHEUNG, NW ;
VONSEEFELD, H ;
NICOLET, MA ;
HO, F ;
ILES, P .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (06) :4297-4299
[3]  
CHEUNG NW, 1980, THIN FILM INTERFACES, P323
[4]  
DHEURLE FM, 1966, T METALL SOC AIME, V236, P321
[5]  
FOURNIER PR, 1975, Patent No. 3879746
[6]   TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM [J].
GARCEAU, WJ ;
FOURNIER, PR ;
HERB, GK .
THIN SOLID FILMS, 1979, 60 (02) :237-247
[7]   COMPRESSIVE STRESS TRANSITION IN AL, V, ZR, NB AND W METAL-FILMS SPUTTERED AT LOW WORKING PRESSURES [J].
HOFFMAN, DW ;
THORNTON, JA .
THIN SOLID FILMS, 1977, 45 (02) :387-396
[8]   INTERNAL-STRESS IN ALUMINUM-OXIDE, TITANIUM CARBIDE AND COPPER-FILMS OBTAINED BY PLANAR MAGNETRON SPUTTERING [J].
KUWAHARA, K ;
SUMOMOGI, T ;
KONDO, M .
THIN SOLID FILMS, 1981, 78 (01) :41-47
[9]  
Maenpaa M., 1981, Fifteenth IEEE Photovoltaic Specialists Conference - 1981, P518
[10]  
MAENPAA M, 1980, THIN FILM INTERFACES, P316