THE EFFECT OF JOINT DESIGN ON THE THERMAL FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS

被引：8

作者：

SHERRY, WM

ERICH, JS

BARTSCHAT, MK

PRINZ, FB

机构：

[1] AT&T BELL LABS,TECH STAFF,MURRAY HILL,NJ 07974

[2] CARNEGIE MELLON UNIV,DEPT MECH ENGN,PITTSBURGH,PA 15213

[3] CARNEGIE MELLON UNIV,INST ROBOT,WELDING LAB,PITTSBURGH,PA 15213

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1985年 / 8卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1985.1136540

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：417 / 426

页数：10

共 29 条

[1]

Argon A.S, 1975, CONSTITUTIVE EQUATIO

[2] STRESS-RELAXATION IN TIN-LEAD SOLDERS [J].

BAKER, E .

MATERIALS SCIENCE AND ENGINEERING, 1979, 38 (03) :241-247

[3]

COOMBS VD, 1976 P INT MICR S, P67

[4]

DANCE FJ, 1982, ELECTRON PACKAGING P, P228

[5]

DUNN BD, 1975, ESA TM162 EUR SPAC A

[6]

GOLDMANN LS, 1969, IBM J RES DEV MAY, P251

[7]

GREER SE, 1978, 28TH P EL COMP C, P166

[8]

Hall P. M., 1984, 34th Electronic Components Conference, P107

[9]

HALL PM, 1983, 33RD EL COMP C, P350

[10]

HOWARD RT, 1983, SOLID STATE TECHNOL, P115