SEMICONDUCTOR JOINING BY SOLID-LIQUID-INTERDIFFUSION (SLID) PROCESS .1. SYSTEMS AG-IN, AU-IN, AND CU-IN

被引：141

作者：

BERNSTEIN, L

机构：

来源：

关键词：

D O I：

10.1149/1.2423806

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1282 / +

页数：1

共 97 条

[71]

LONGO TA, 1963, SEMI PROD, V6, P12

[72]

Mclean D., 1957, GRAIN BOUNDARIES MET

[73] THE PROPERTIES OF THE INTERMETALLIC PHASES IN THE SYSTEM AU-SN [J].

MCNEIL, MB .

[74]

MEHL RF, 1940, T AIME, V137, P301

[75]

PASSMORE EM, 1963, WELDING J RESEARCH S, V42, pS186

[76]

POWELL GW, 1964, T METALL SOC AIME, V230, P694

[77]

RAPP RA, 1965, ACTA METALL, V12, P505

[78]

RHINES FN, 1941, T AM SOC MET, P122

[79]

SARTELL JA, 1964, J I MET, V93, P19

[80]

SCHMIDT R, 1962, SOLIDSTATE DEVICE RE