A STUDY OF ROOM-TEMPERATURE CU-AL2O3 AND CU-AIN INTERFACIAL REACTIONS

[1] CHARACTERIZATION OF CU-AL2O3 CATALYSTS [J]. JOURNAL OF CATALYSIS, 1978, 55 (01) : 10 - 28

[2] VALENCE-BAND AND CONDUCTION-BAND STRUCTURE OF THE SAPPHIRE (1102) SURFACE [J]. PHYSICAL REVIEW B, 1985, 32 (02): : 1237 - 1247

[3] THICK-FILM AND DIRECT BOND COPPER FORMING TECHNOLOGIES FOR ALUMINUM NITRIDE SUBSTRATE [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (02): : 253 - 258

[4] MOLECULAR-ORBITAL MODEL FOR METAL-SAPPHIRE INTERFACIAL STRENGTH [J]. JOURNAL OF APPLIED PHYSICS, 1982, 53 (10) : 6634 - 6637

[5] KLOMP JT, 1985, MATER RES SOC S P, V40, P381

[6] KLUGEWEISS P, 1985, MATER RES SOC S P, V40, P399

[7] MACKRODT WC, 1986, IN PRESS J PHYS CHEM

[8] EFFECT OF OXYGEN ON REACTION BETWEEN COPPER AND SAPPHIRE [J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1974, 57 (08) : 329 - 332

[9] OHUCHI FS, IN PRESS J APPL PHYS

[10] SHEAR-STRENGTH OF METAL-SAPPHIRE CONTACTS [J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (03) : 801 - 808

[1] CHARACTERIZATION OF CU-AL2O3 CATALYSTS [J]. JOURNAL OF CATALYSIS, 1978, 55 (01) : 10 - 28

[2] VALENCE-BAND AND CONDUCTION-BAND STRUCTURE OF THE SAPPHIRE (1102) SURFACE [J]. PHYSICAL REVIEW B, 1985, 32 (02): : 1237 - 1247

[3] THICK-FILM AND DIRECT BOND COPPER FORMING TECHNOLOGIES FOR ALUMINUM NITRIDE SUBSTRATE [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (02): : 253 - 258

[4] MOLECULAR-ORBITAL MODEL FOR METAL-SAPPHIRE INTERFACIAL STRENGTH [J]. JOURNAL OF APPLIED PHYSICS, 1982, 53 (10) : 6634 - 6637

[5] KLOMP JT, 1985, MATER RES SOC S P, V40, P381

[6] KLUGEWEISS P, 1985, MATER RES SOC S P, V40, P399

[7] MACKRODT WC, 1986, IN PRESS J PHYS CHEM

[8] EFFECT OF OXYGEN ON REACTION BETWEEN COPPER AND SAPPHIRE [J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1974, 57 (08) : 329 - 332

[9] OHUCHI FS, IN PRESS J APPL PHYS

[10] SHEAR-STRENGTH OF METAL-SAPPHIRE CONTACTS [J]. JOURNAL OF APPLIED PHYSICS, 1976, 47 (03) : 801 - 808