LOW-TEMPERATURE VOID GROWTH AND RESISTIVITY DECAY IN THIN EVAPORATED GOLD-FILMS

被引：28

作者：

LLOYD, JR

NAKAHARA, S

机构：

[1] STEVENS INST TECHNOL,DEPT MAT & MET ENGN,HOBOKEN,NJ 07030

[2] BELL TEL LABS INC,MURRAY HILL,NJ 07974

来源：

THIN SOLID FILMS | 1977年 / 45卷 / 02期

关键词：

D O I：

10.1016/0040-6090(77)90282-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：411 / 420

页数：10

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[6]

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[7] STUDY ON VACUUM DEPOSITION OF METALS .2. ON THE CHANGE WITH AGING TIME IN THICKNESS AND RESISTIVITY OF VACUUM DEPOSITED GOLD FILM [J].

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[8]

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[9]

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[10]

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