FABRICATION OF SHORT CHANNEL MOSFETS WITH REFRACTORY-METAL GATES USING RF SPUTTER ETCHING

被引:10
作者
RODRIGUEZ, A [1 ]
MISRA, M [1 ]
HESSELBOM, H [1 ]
TOVE, PA [1 ]
机构
[1] UNIV UPPSALA,INST TECHNOL,ELECTR DEPT,UPPSALA,SWEDEN
关键词
D O I
10.1016/0038-1101(76)90126-X
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
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页码:17 / &
相关论文
共 11 条
[1]   REFRACTORY METAL SILICON DEVICE TECHNOLOGY [J].
BROWN, DM ;
ENGELER, WE ;
GARFINKEL, M ;
GRAY, PV .
SOLID-STATE ELECTRONICS, 1968, 11 (12) :1105-+
[2]  
BROWN DM, 1971, IEEE T ELECTRON DEVI, V18
[3]  
ENGELER WE, 1972, IEEE T ELECTRON DEVI, V19
[4]  
GARVIN HL, 1973, SOLID STATE TECH NOV, P31
[5]  
GOESNEY WM, 1973, IEEE T ELECTRON DEVI, V20
[6]  
GOSNEY WM, 1972, IEEE T ELECTRON DEVI, V19
[7]  
GROVE AS, 1967, PHYS TECHNOL S, P342
[8]   FUNDAMENTAL LIMITATIONS IN MICROELECTRONICS .1. MOS TECHNOLOGY [J].
HOENEISEN, B ;
MEAD, CA .
SOLID-STATE ELECTRONICS, 1972, 15 (07) :819-+
[9]  
LAU SS, 1972, J VAC SCI TECHNOL, V9
[10]  
SPENCER EG, 1970, APPL PHYS LETT, V17