DYNAMICS OF TRANSGRANULAR VOIDS IN METALLIC THIN-FILMS UNDER ELECTROMIGRATION CONDITIONS

被引：46

作者：

MAROUDAS, D

机构：

[1] Department of Chemical and Nuclear Engineering, University of California, Santa Barbara, Santa Barbara

来源：

APPLIED PHYSICS LETTERS | 1995年 / 67卷 / 06期

关键词：

D O I：

10.1063/1.115471

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A theoretical analysis is presented for the morphological evolution and stability of transgranular wedge-shaped voids in conductor Lines with bamboo grain structure under an applied electric field. A linear stability analysis identifies void shapes that become unstable with respect to the growth of perturbations with wavelengths longer than a critical wavelength. The analysis predicts a critical wavelength that is consistent with experimental observations in unpassivated aluminum lines. The predicted changes in shape during the morphological evolution of the void surfaces are in agreement with the experimental observations. (C) 1995 American Institute of Physics.

引用

页码：798 / 800

页数：3

共 10 条

[1] ELECTROMIGRATION FAILURE BY SHAPE CHANGE OF VOIDS IN BAMBOO LINES [J].