HEAT-TRANSPORT FROM A CHIP

被引：28

作者：

LANG, W

机构：

[1] the Fraunhofer Institut für Festkörpertechnologie, Munich, 60

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1990年 / 37卷 / 04期

关键词：

D O I：

10.1109/16.52430

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The heat transport from a chip due to conduction and interphase heat transfer from the chip to the surrounding air is investigated. Experiments are performed with thin diaphragms of silicon ni-tride, which can be heated by a thin-film resistor. The heat losses of the devices are measured in vacuum and in air. The influence of temperature, geometry, and heat sinks is investigated. Heat transfer is described by the transfer coefficient, which is a function of the temperature and the size of the chip. The calculated heat losses are in good agreement with the experimental values. © 1990 IEEE

引用

页码：958 / 963

页数：6

共 9 条

[1] THE THERMAL MODELING OF INTEGRATED-CIRCUIT DEVICE PACKAGES [J].

BARGADDA, R .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (09) :1934-1938

[2]

Bird R.B., 1960, TRANSPORT PHENOMENA, P412

[3] INTEGRATED CIRCUIT THERMAL MODELING [J].

CASTELLO, R ;

ANTOGNETTI, P .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1978, 13 (03) :363-366

[4] THERMAL MANAGEMENT OF INTEGRATED MICROSENSORS [J].

CRARY, SB .

SENSORS AND ACTUATORS, 1987, 12 (04) :303-312

[5]

GRIGULL U, 1979, WARMELEITUNG

[6] AN ANALYSIS OF THE THERMAL RESPONSE OF POWER CHIP PACKAGES [J].

KADAMBI, V ;

ABUAF, N .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (06) :1024-1033

[7]

Pitts D. R., 1977, HEAT TRANSFER

[8] THERMAL SIMULATION OF INTEGRATED DIGITAL TRANSDUCERS [J].

STEGER, U ;

REICHL, H .

SENSORS AND ACTUATORS, 1983, 4 (04) :621-627

[9]

Tsotsas E., 1984, Chemical Engineering and Processing, V18, P25, DOI 10.1016/0255-2701(84)85006-0

← 1 →