AN ANALYSIS OF THE THERMAL RESPONSE OF POWER CHIP PACKAGES

被引：46

作者：

KADAMBI, V

ABUAF, N

机构：

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1985年 / 32卷 / 06期

关键词：

D O I：

10.1109/T-ED.1985.22068

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1024 / 1033

页数：10

共 19 条

[1]

ADAMIAN A, 1977, MACH DES, V49, P106

[2] 3-DIMENSIONAL TRANSIENT THERMAL SIMULATION - APPLICATION TO DELAYED SHORT-CIRCUIT PROTECTION IN POWER ICS [J].

ANTOGNETTI, P ;

BISIO, GR ;

CURATELLI, F ;

PALARA, S .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1980, 15 (03) :277-281

[3] HIGH-TEMPERATURE THERMAL CHARACTERISTICS OF MICROELECTRONIC PACKAGES [J].

BAXTER, GK ;

ANSLOW, JW .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (04) :385-390

[4] MICROELECTRONIC PACKAGING [J].

BLODGETT, AJ .

SCIENTIFIC AMERICAN, 1983, 249 (01) :86-&

[5]

BREBBIA CA, 1984, BOUNDARY ELEMENT TEC, P102

[6]

CARLSON RO, 1982, 82CRD264 GEN EL CO R

[7] INTEGRATED CIRCUIT THERMAL MODELING [J].

CASTELLO, R ;

ANTOGNETTI, P .

IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1978, 13 (03) :363-366

[8]

COHEN AB, 1983, MECH ENG, P53

[9] EFFECT OF SOME COMPOSITE STRUCTURES ON THERMAL RESISTANCE OF SUBSTRATES AND INTEGRATED-CIRCUIT CHIPS [J].

ELLISON, GN .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1973, ED20 (03) :233-239

[10]

EMERALD PR, 1977, MACH DES, V49, P98

← 1 2 →