MATERIAL CHARACTERIZATION OF TI-CU-NI-AU (TCNA) - NEW LOW-COST THIN-FILM CONDUCTOR SYSTEM

被引：27

作者：

MORABITO, JM ^{[1
]}

THOMAS, JH ^{[1
]}

LESH, NG ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1975年 / 11卷 / 04期

关键词：

D O I：

10.1109/TPHP.1975.1135074

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：253 / 262

页数：10

共 27 条

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[2]

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[3]

BADER WG, UNPUBLISHED DATA

[4]

BILL MJ, UNPUBLISHED DATA

BORDERS, JA .

[6]

DANILOVA EI, 1955, IZV AKAD NAUK SSSR O, V11, P25

[7]

DARKEN LS, 1951, ATOM MOVEMENTS, P21

[8]

ENGLISH AT, 1972, J ELECTRONIC MATERIA, V1

[9] TERMINATION MATERIALS FOR THIN FILM RESISTORS [J].

FISHER, JS ;

HALL, PM .

PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10) :1418-&

[10]

FOSTER JF, UNPUBLISHED DATA