PROPERTIES OF CHEMICALLY VAPOR-DEPOSITED TUNGSTEN THIN-FILMS ON SILICON-WAFERS

被引:17
作者
DIEM, M
FISK, M
GOLDMAN, J
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D O I
10.1016/0040-6090(83)90005-6
中图分类号
T [工业技术];
学科分类号
08 ;
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页码:39 / 43
页数:5
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