GRAIN-SIZE AND GROWTH OF NI-RICH NI-AL ALLOY-FILMS

被引：25

作者：

HENTZELL, HTG ^{[1
]}

ANDERSSON, B ^{[1
]}

KARLSSON, SE ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

ACTA METALLURGICA | 1983年 / 31卷 / 12期

关键词：

D O I：

10.1016/0001-6160(83)90029-9

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：2103 / 2111

页数：9

共 50 条

[1] STRUCTURE AND PROPERTY RELATIONSHIPS OF NI-20CR PRODUCED BY HIGH-RATE PHYSICAL VAPOR-DEPOSITION
AGARWAL, N
KANE, N
BUNSHAH, RF
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (02): : 619 - 623
[2] ANDERSSON B, UNPUB ACTA METALL
[3] ANDERSSON B, 1982, LINKOPING STUDIES SC, V75
[4] ANDERSSON KAB, 1979, THIN SOLID FILMS, V53, P345
[5] FORMATION OF ALUMINUM THIN-FILMS IN THE PRESENCE OF OXYGEN AND NICKEL
BARNA, A
BARNA, PB
RADNOCZI, G
REICHA, FM
TOTH, L
[J]. PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, 1979, 55 (02): : 427 - 435
[6] BLAKELY JM, 1967, ACTA METALL, V9, P23
[7] BRAUN A, 1955, REVUE METALLURGIE, V52, P676
[8] INTERNAL STRESSES
BUCKEL, W
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04): : 606 - +
[9] METASTABLE ALLOY PHASES BY CO-SPUTTERING
CANTOR, B
CAHN, RW
[J]. ACTA METALLURGICA, 1976, 24 (09): : 845 - 852
[10] CHOPRA KL, 1969, THIN FILM PHENOMENA, P137