CHARACTERIZATION OF THE ELECTROSTATIC BONDING OF SILICON AND PYREX GLASS

被引：139

作者：

COZMA, A

PUERS, B

机构：

[1] Katholicke Universiteit Leuven, ESAT-MICAS Division, 83001 Heverlee

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1995年 / 5卷 / 02期

关键词：

D O I：

10.1088/0960-1317/5/2/010

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The electrostatic bonding of silicon and Pyrex glass was studied in order to find out the influence of process parameters on the final result and to be able to optimize the process with regard to the fabrication of silicon sensors. The most important parameters are the temperature and the voltage. The main criterion used for the optimization of their values was the induced stress in the silicon part of the bonded ensemble. it was found that a temperature of 360 degrees C and voltages in the range 750-1000 V are suitable.

引用

页码：98 / 102

页数：5

共 9 条

[1] BACKLUND Y, 1992, MME 92, P26
[2] Cozma A, 1994, THESIS KU LEUVEN BEL
[3] ESASHI M, 1990, SENSOR ACTUAT A-PHYS, V21, P931
[4] THE MECHANISM OF FIELD-ASSISTED SILICON GLASS BONDING
KANDA, Y
MATSUDA, K
MURAYAMA, C
SUGAYA, J
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 1990, 23 (1-3) : 939 - 943
[5] KLOECK B, 1989, THESIS U NEUCHATEL S
[6] KO WH, 1985, MICROMACHINING MICRO
[7] PEETERS E, 1994, THESIS K U LEUVEN
[8] A CAPACITIVE PRESSURE SENSOR WITH LOW IMPEDANCE OUTPUT AND ACTIVE SUPPRESSION OF PARASITIC EFFECTS
PUERS, B
PEETERS, E
VANDENBOSSCHE, A
SANSEN, W
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 1990, 21 (1-3) : 108 - 114
[9] EXTREMELY MINIATURIZED CAPACITIVE MOVEMENT SENSORS USING NEW SUSPENSION SYSTEMS
PUERS, B
LAPADATU, D
[J]. SENSORS AND ACTUATORS A-PHYSICAL, 1994, 41 (1-3) : 129 - 135

← 1 →