THE ROLE OF THE INSULATOR IN DETERMINING 1/F NOISE IN HG1-XCDXTE INTEGRATING MIS DEVICES

被引:7
作者
MELENDEZ, JL [1 ]
BECK, J [1 ]
机构
[1] TEXAS INSTRUMENTS INC,CENT RES LABS,DALLAS,TX 75265
关键词
HGCDTE; 1/F NOISE; INTEGRATING MIS DEVICES; ZNS;
D O I
10.1007/BF02817515
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The low frequency 1/f noise charge found in Hg1-xCdxTe integrating metal-insulator-semiconductor (MIS) devices operating at 40K and low bias above threshold is found to be independent of integration time. The signal theory of random processes is utilized to demonstrate that 1/f noise charge resulting from carrier number fluctuations due to insulator traps should not depend on integration time, while 1/f noise charge resulting from 1/f noise in any current filling the MIS well should be proportional to integration time. This distinction allows for the determination of effective insulator trap densities from low temperature 1/f noise data on simple MIS structures. The technique is applied to a number of n-channel and p-channel devices and the effective trap densities in ZnS are determined.
引用
收藏
页码:993 / 998
页数:6
相关论文
共 15 条
[1]   SURFACE-TUNNELING-INDUCED 1/F NOISE IN HG1-XCDXTE PHOTO-DIODES [J].
ANDERSON, WW ;
HOFFMAN, HJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1983, 1 (03) :1730-1734
[2]  
FRANZ W, 1956, HDB PHYSIK, V17, P155
[3]   SURFACE STATE RELATED 1/F NOISE IN P!N JUNCTIONS [J].
HSU, ST .
SOLID-STATE ELECTRONICS, 1970, 13 (06) :843-+
[4]   A 1/F NOISE TECHNIQUE TO EXTRACT THE OXIDE TRAP DENSITY NEAR THE CONDUCTION-BAND EDGE OF SILICON [J].
JAYARAMAN, R ;
SODINI, CG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (09) :1773-1782
[5]  
JAYARAMAN R, 1988, THESIS MIT
[6]  
JOSE L, 1991, THESIS MIT
[7]  
JOSE L, 1990, THESIS MIT
[8]  
KINCH MA, 1987, MATER RES SOC S P, V90, P15
[9]   EXPERIMENTAL DETERMINATION OF E-K RELATIONSHIP IN ELECTRON TUNNELING [J].
LEWICKI, G ;
MEAD, CA .
PHYSICAL REVIEW LETTERS, 1966, 16 (21) :939-&
[10]  
McWhorter A. L., 1957, SEMICONDUCTOR SURFAC, V207, P207, DOI DOI 10.1063/1.3060496