ULTRASONIC WELDING MECHANISM AS APPLIED TO ALUMINUM-WIRE AND GOLD-WIRE BONDING IN MICROELECTRONICS

被引：153

作者：

HARMAN, GG ^{[1
]}

ALBERS, J ^{[1
]}

机构：

[1] NBS, INST APPL TECHNOL, DIV ELECTR TECHNOL, WASHINGTON, DC 20234 USA

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1977年 / 13卷 / 04期

关键词：

D O I：

10.1109/TPHP.1977.1135225

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：406 / 412

页数：7

共 25 条

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CHEVALIER, JL
LEONARD, L
GIBBONS, DF
[J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (01) : 73 - +
[4] COUCOULAS A, 1966, T METALL SOC AIME, V236, P587
[5] ENGLISH AT, 1971, 9TH ANN P REL PHYS, P178
[6] INTERNAL LEAD FATIGUE THROUGH THERMAL EXPANSION IN SEMICONDUCTOR DEVICES
GAFFNEY, J
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1968, ED15 (08) : 617 - &
[7] HARMAN GG, 1974, NBS4002 SPEC PUBL, P29
[8] HARMAN GG, 1972, 10 ANN P REL PHYS S, P49
[9] HARMAN GG, 1974, 12 ANN P IEEE REL PH, P131
[10] JELLISON JL, 1976, P EL COMP C, P92