CREEP AND STRESS-RELAXATION IN SOLDER JOINTS OF SURFACE-MOUNTED CHIP CARRIERS

被引：27

作者：

HALL, PM

机构：

[1] AT&T Bell Lab, Allentown, PA,, USA, AT&T Bell Lab, Allentown, PA, USA

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1987.1134800

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：556 / 565

页数：10

共 15 条

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[8] EXPERIMENTAL CONSTITUTIVE RELATIONS FOR THE HIGH-TEMPERATURE DEFORMATION OF A PB-SN EUTECTIC ALLOY [J].

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