MANUFACTURING ASPECTS OF LOW-PRESSURE CHEMICAL-VAPOR-DEPOSITED TIN BARRIER LAYERS

被引：34

作者：

TRAVIS, EO

FIORDALICE, RW

机构：

[1] Motorola Advanced Products Research, Development Laboratory, Austin, TX

来源：

THIN SOLID FILMS | 1993年 / 236卷 / 1-2期

关键词：

D O I：

10.1016/0040-6090(93)90690-Q

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The growth in the number of applications of TiN in recent years has put increasing demands on the performance of TiN films. The use of TIN films in applications such as contact barriers, glue layers and sidewall spacers is discussed, integration issues are considered, and future requirements of devices incorporating TiN films are suggested.

引用

页码：325 / 329

页数：5

共 19 条

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