CRYSTALLIZATION, RESISTIVITY AND MICROSTRUCTURE OF CO-DEPOSITED METAL-SILICON THIN-FILM ALLOYS

被引：14

作者：

SMITH, DA

TU, KN

WEISS, BZ

机构：

[1] IBM, Yorktown Heights, NY, USA, IBM, Yorktown Heights, NY, USA

来源：

ULTRAMICROSCOPY | 1987年 / 23卷 / 3-4期

关键词：

D O I：

10.1016/0304-3991(87)90251-8

中图分类号：

TH742 [显微镜];

学科分类号：

摘要：

4

引用

收藏

页码：405 / 410

页数：6

相关论文

共 5 条

[1] CAHN JW, 1959, T MET SOC AIME, V215, P57
[2] METASTABLE EVAPORATED THIN FILMS OF CU-AG AND CO-AU ALLOYS .2. KINETICS OF TRANSFORMATIONS
MADER, S
NOWICK, AS
[J]. ACTA METALLURGICA, 1967, 15 (02): : 215 - +
[3] METASTABLE EVAPORATED THIN FILMS OF CU-AG AND CO-AU ALLOYS .I. OCCURRENCE AND MORPHOLOGY OF PHASES
MADER, S
NOWICK, AS
WIDMER, H
[J]. ACTA METALLURGICA, 1967, 15 (02): : 203 - +
[4] Tu K. N., 1978, Thin films. Interdiffusion and reactions, P359
[5] EFFECT OF TEMPERATURE ON ELECTRICAL AND MICROSTRUCTURAL CHANGES OF COEVAPORATED IR-SI ALLOY-FILMS
WEISS, BZ
TU, KN
SMITH, DA
[J]. JOURNAL OF APPLIED PHYSICS, 1986, 59 (02) : 415 - 423