THERMOELASTIC ANALYSIS OF GAAS IN LEC GROWTH CONFIGURATION .1. EFFECT OF LIQUID ENCAPSULATION ON THERMAL-STRESSES

被引:46
作者
MOTAKEF, S [1 ]
WITT, AF [1 ]
机构
[1] MIT,DEPT MAT SCI & ENGN,CAMBRIDGE,MA 02139
关键词
D O I
10.1016/0022-0248(87)90521-5
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
引用
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页码:37 / 50
页数:14
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