CERAMIC METAL INTERFACIAL CRACK-GROWTH - TOUGHENING BY CONTROLLED MICROCRACKS AND INTERFACIAL GEOMETRIES

被引：56

作者：

OH, TS ^{[1
]}

RODEL, J ^{[1
]}

CANNON, RM ^{[1
]}

RITCHIE, RO ^{[1
]}

机构：

[1] UNIV CALIF BERKELEY,DEPT MAT SCI & MINERAL ENGN,BERKELEY,CA 94720

来源：

ACTA METALLURGICA | 1988年 / 36卷 / 08期

关键词：

D O I：

10.1016/0001-6160(88)90310-0

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

收藏

页码：2083 / 2093

页数：11

相关论文

共 44 条

[1] GOLD-TO-ALUMINA SOLID-STATE REACTION BONDING
BAILEY, FP
BLACK, KJT
[J]. JOURNAL OF MATERIALS SCIENCE, 1978, 13 (05) : 1045 - 1052
[2] ADHERENCE-FRACTURE ENERGY OF A GLASS-BONDED THICK-FILM CONDUCTOR - EFFECT OF FIRING CONDITIONS
BECHER, PF
NEWELL, WL
[J]. JOURNAL OF MATERIALS SCIENCE, 1977, 12 (01) : 90 - 96
[3] MICROELECTRONIC PACKAGING
BLODGETT, AJ
[J]. SCIENTIFIC AMERICAN, 1983, 249 (01) : 86 - &
[4] THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE
BLODGETT, AJ
BARBOUR, DR
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 30 - 36
[5] MULTILAYER CERAMICS MANUFACTURING
BURGER, WG
WEIGEL, CW
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1983, 27 (01) : 11 - 19
[6] CANNON RM, 1986, MATER RES SOC S P, V72, P121
[7] CANNON RM, 1987, CERAMIC MICROSTRUCTU, P959
[8] CANNON RM, 1988, J AM CERAM SOC, V71
[9] THIN-FILM ADHESION
CHAPMAN, BN
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01): : 106 - 113
[10] CHEN WT, 1979, IBM J RES DEV, V3, P179

← 1 2 3 4 5 →