A HIGH-PERFORMANCE THERMAL MODULE FOR COMPUTER PACKAGING

[1] THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 30 - 36

[2] DANIELSON RD, 1986, ELECTRON PACKAG JUL, P44

[3] Dongarra JJ, 1979, LINPACK USERS GUIDE

[4] FOX, 1985, INTRO FLUID MECHANIC

[5] GEBHART B, 1971, HEAT TRANSFER, P48

[6] HWANG L, IN PRESS

[7] Kishimoto T., 1986, 36th Electronic Components Conference Proceedings 1986 (Cat. No.86CH2302-8), P595

[8] WAFER BONDING FOR SILICON-ON-INSULATOR TECHNOLOGIES [J]. APPLIED PHYSICS LETTERS, 1986, 48 (01) : 78 - 80

[9] THERMAL MANAGEMENT IN SEMICONDUCTOR-DEVICE PACKAGING [J]. PROCEEDINGS OF THE IEEE, 1985, 73 (09) : 1396 - 1404

[10] MOORE TJ, 1986, NASA TECH BRIEFS, P118

[1] THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 30 - 36

[2] DANIELSON RD, 1986, ELECTRON PACKAG JUL, P44

[3] Dongarra JJ, 1979, LINPACK USERS GUIDE

[4] FOX, 1985, INTRO FLUID MECHANIC

[5] GEBHART B, 1971, HEAT TRANSFER, P48

[6] HWANG L, IN PRESS

[7] Kishimoto T., 1986, 36th Electronic Components Conference Proceedings 1986 (Cat. No.86CH2302-8), P595

[8] WAFER BONDING FOR SILICON-ON-INSULATOR TECHNOLOGIES [J]. APPLIED PHYSICS LETTERS, 1986, 48 (01) : 78 - 80

[9] THERMAL MANAGEMENT IN SEMICONDUCTOR-DEVICE PACKAGING [J]. PROCEEDINGS OF THE IEEE, 1985, 73 (09) : 1396 - 1404

[10] MOORE TJ, 1986, NASA TECH BRIEFS, P118