INTERNAL STRESSES AND INTERDIFFUSION OF TI-PD-AU FILMS STUDIED BY X-RAY-DIFFRACTION TECHNIQUES

被引：21

作者：

LAU, SS

SUN, RC

机构：

来源：

关键词：

D O I：

10.1016/0040-6090(72)90194-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：273 / +

页数：1

共 11 条

[1] DISLOCATION ARRANGEMENTS RESXULTING FROM DIFFUSION OF ZN INTO CU - ETCH-PIT STUDIES
AYRES, PS
WINCHELL, PG
[J]. JOURNAL OF APPLIED PHYSICS, 1968, 39 (10) : 4820 - &
[2] Boiko B. T., 1968, Fizika Metallov i Metallovedenie, V25, P845
[3] CHOPRA KL, 1969, THIN FILM PHENOMENA, pCH5
[4] TERMINATION MATERIALS FOR THIN FILM RESISTORS
FISHER, JS
HALL, PM
[J]. PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10): : 1418 - &
[5] Hansen M., 1958, CONSTITUTION BINARY, P224
[6] KINBARA A, 1965, JPN J APPL PHYS, V4, P234
[7] MATHEWS JW, 1964, SINGLE CRYSTAL FILMS, P165
[8] Pearson W. B., 1964, HDB LATTICE SPACINGS, V2
[9] SPEIGHT JD, 1971, P RELIABILITY PHYSIC, P195
[10] X-RAY DIFFRACTION TECHNIQUE FOR INVESTIGATION OF SMALL DIFFUSION ZONES
TENNEY, DR
CARPENTER, JA
HOUSKA, CR
[J]. JOURNAL OF APPLIED PHYSICS, 1970, 41 (11) : 4485 - +