ACTIVATION ENERGY FOR ELECTROMIGRATION IN ALUMINUM FILMS ALLOYED WITH COPPER

[1] GROWTH OF GRAIN BOUNDARY PRECIPITATES IN A1-4 PERCENT CU BY INTERFACIAL DIFFUSION [J]. ACTA METALLURGICA, 1968, 16 (06): : 789 - &

[2] SULFUR SEGREGATION AT ALPHA-IRON GRAIN BOUNDARIES .2. [J]. ACTA METALLURGICA, 1960, 8 (08): : 528 - 538

[3] DIFFUSION OF SOLUTES IN ALUMINUM AND DILUTE ALUMINUM ALLOYS [J]. PHYSICAL REVIEW B-SOLID STATE, 1970, 1 (08): : 3274 - +

[4] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[5] AUST K, 1965, ULTRA HIGH PURITY ME, P115

[6] AUSTIN A, 1961, J APPL PHYS, V33, P3569

[7] BARRETT CS, 1952, STRUCTURE METALS, P646

[8] BLACK JR, 1969, IEEE T ELECTRON DEVI, VED16, P338

[9] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[10] D'Heurle F., 1970, Applied Physics Letters, V16, P80, DOI 10.1063/1.1653108

[1] GROWTH OF GRAIN BOUNDARY PRECIPITATES IN A1-4 PERCENT CU BY INTERFACIAL DIFFUSION [J]. ACTA METALLURGICA, 1968, 16 (06): : 789 - &

[2] SULFUR SEGREGATION AT ALPHA-IRON GRAIN BOUNDARIES .2. [J]. ACTA METALLURGICA, 1960, 8 (08): : 528 - 538

[3] DIFFUSION OF SOLUTES IN ALUMINUM AND DILUTE ALUMINUM ALLOYS [J]. PHYSICAL REVIEW B-SOLID STATE, 1970, 1 (08): : 3274 - +

[4] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) : 461 - +

[5] AUST K, 1965, ULTRA HIGH PURITY ME, P115

[6] AUSTIN A, 1961, J APPL PHYS, V33, P3569

[7] BARRETT CS, 1952, STRUCTURE METALS, P646

[8] BLACK JR, 1969, IEEE T ELECTRON DEVI, VED16, P338

[9] ELECTROMIGRATION IN THIN AL FILMS [J]. JOURNAL OF APPLIED PHYSICS, 1969, 40 (02) : 485 - &

[10] D'Heurle F., 1970, Applied Physics Letters, V16, P80, DOI 10.1063/1.1653108