CHARACTERIZATION OF ANODIZED ALUMINIUM-COPPER VAPOR-DEPOSITED FILMS BY ION SCATTERING SPECTROMETRY

Composition-depth profiles for anodized films, 100 Å thick, formed under galvanostatic conditions on vapour-deposited aluminium containing 1-10 at.% copper have been obtained via Ion Scattering Spectrometry (ISS). The O{single bond}Al ratio found for the anodic layer corresponds to that for Al2O3 and the Cu concentration in the aluminium metal measured near the oxide-metal interface was similar to that for non-oxidized alloys. Additionally, no metallic impurities (> 0.1 at.%) were detectable in the oxide layer or the alloy. © 1979 Pergamon Press Ltd.