INVESTIGATION OF AGITATION EFFECTS ON ELECTROPLATED COPPER IN MULTILAYER BOARD PLATED THROUGH HOLES IN A FORCED-FLOW PLATING CELL

被引：23

作者：

ENGELMAIER, W

KESSLER, T

机构：

来源：

关键词：

D O I：

10.1149/1.2131394

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：36 / 43

页数：8

共 17 条

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[3] BLUE JL, UNPUBLISHED
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[6] ENGELMAIER W, 1975, OCT EL SOC M DALL
[7] IRVINE TH, 1967, MET FINISH, V65, P85
[8] Kessler T., 1976, Plating and Surface Finishing, V63, P22
[9] MODEL FOR COPPER ELECTROPLATING OF MULTILAYER PRINTED WIRING BOARDS
KESSLER, T
ALKIRE, R
[J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (07) : 990 - 999
[10] MIRAREFI AA, 1976, MAY EL SOC M WASH