REACTIONS AT THE POLYIMIDE METAL INTERFACE

被引：23

作者：

FREILICH, SC

OHUCHI, FS

机构：

[1] E. I. du Pont de Nemours, Co. Inc., Central Research and Development Department, Wilmington, DE 19898, United States

来源：

POLYMER | 1987年 / 28卷 / 11期

关键词：

COPPER AND ALLOYS - Chemical Deposition - POLYMERS - Reactions - SPECTROSCOPY; ULTRAVIOLET;

D O I：

10.1016/0032-3861(87)90299-0

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Ultra-high-vacuum spectroscopic techniques are utilized to investigate the mechanism of the interfacial reactions of copper and titanium with polyimides. Ultra-violet photoemission spectroscopy of in situ deposited Cu on polyimides suggests that covalent interaction between the metal and the polymer is absent. Model studies confirm this finding. Alternatively, deposition of Ti onto polyimides shows the presence of strong covalent interaction between the imide moiety of the polymer backbone and the metal. Solution model studies support a mechanism for the Ti-polyimide reaction involving initial Ti-O bond formation followed by Ti-C bonding at higher coverages of material.

引用

页码：1908 / 1914

页数：7