DIFFUSION IN GOLD-ALUMINIUM

被引:23
作者
WEAVER, C
PARKINSON, DT
机构
关键词
D O I
10.1080/14786437008228230
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:377 / +
页数:1
相关论文
共 16 条
[1]   MEASUREMENT OF ADHESION OF THIN FILMS [J].
BENJAMIN, P ;
WEAVER, C .
PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1960, 254 (1277) :163-176
[2]  
FRANCOMBE MH, 1967, THIN SOLID FILMS, V1, P353
[3]   The conductivity of thin metallic films according to the electron theory of metals [J].
Fuchs, K .
PROCEEDINGS OF THE CAMBRIDGE PHILOSOPHICAL SOCIETY, 1938, 34 :100-108
[4]   DIFFUSION LAYER GROWTH IN A BINARY SYSTEM [J].
GIBBS, GB .
JOURNAL OF NUCLEAR MATERIALS, 1966, 20 (03) :303-&
[5]  
HANSEN M, 1958, CONSTITUTION BINARY, P69
[6]   SOME FACTORS INFLUENCING THE ADHESION OF FILMS PRODUCED BY VACUUM EVAPORATION [J].
HEAVENS, OS .
JOURNAL DE PHYSIQUE ET LE RADIUM, 1950, 11 (07) :355-360
[7]   ELECTRICAL CONDUCTIVITY OF THIN METALLIC FILMS WITH UNLIKE SURFACES [J].
LUCAS, MSP .
JOURNAL OF APPLIED PHYSICS, 1965, 36 (05) :1632-&
[8]  
SHUNK FA, 1969, CONSTITUTION BINARY
[9]   LATTICE PARAMETERS EXPANSION COEFFICIENTS + EXTENT OF AL2AU PHASE [J].
STRAUMANIS, ME ;
CHOPRA, KS .
ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE-FRANKFURT, 1964, 42 (5-6) :344-&
[10]   MEASUREMENT OF DIFFUSION-INDUCED STRAINS AT METAL BOND INTERFACES [J].
TAKEI, WJ ;
FRANCOMB.MH .
SOLID-STATE ELECTRONICS, 1968, 11 (02) :205-&