INTERDIFFUSION IN CU-AU THIN-FILM SYSTEM AT 25DEGREESC TO 250DEGREESC

被引：54

作者：

HALL, PM ^{[1
]}

MORABITO, JM ^{[1
]}

PANOUSIS, NT ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

THIN SOLID FILMS | 1977年 / 41卷 / 03期

关键词：

D O I：

10.1016/0040-6090(77)90320-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：341 / 361

页数：21

共 41 条

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[3]

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[4]

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[5]

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[7]

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[8]

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[9]

Butrymowicz D. B., 1974, Journal of Physical and Chemical Reference Data, V3, P527, DOI 10.1063/1.3253145

[10] LOW-TEMPERATURE INTERDIFFUSION IN COPPER-GOLD THIN-FILMS ANALYZED BY HELIUM BACKSCATTERING [J].

CAMPISAN.SU ;

FOTI, G ;

GRASSO, F ;

RIMINI, E .

THIN SOLID FILMS, 1973, 19 (02) :339-348

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