A CONDUCTION-COOLED MODULE FOR HIGH-PERFORMANCE LSI DEVICES

被引：41

作者：

OKTAY, S ^{[1
]}

KAMMERER, HC ^{[1
]}

机构：

[1] IBM CORP,DATA SYST DIV LAB,POUGHKEEPSIE,NY 12602

来源：

关键词：

D O I：

10.1147/rd.261.0055

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：55 / 66

页数：12

共 12 条

[1] BURDE SS, 1978, 2ND AM I ASTR AER AI
[2] CONDUCTION COOLING FOR AN LSI PACKAGE - A ONE-DIMENSIONAL APPROACH
CHU, RC
HWANG, UP
SIMONS, RE
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 45 - 54
[3] Chu Richard C., 1976, U.S. Patent, Patent No. [3,993,123A, 3993123]
[4] HWANG UP, 1979, IBM TECH DISCLOSURE, V21, P4028
[5] HWANG UP, 1978, IBM TECH DISCLOSURE, V20, P4780
[6] HWANG UP, 1978, IBM TECH DISCLOSURE, V20, P4334
[7] LIPSCHUTZ LD, 1978, IBM TECH DISCLOSURE, V21, P1565
[8] PARAMETRIC STUDY OF TEMPERATURE PROFILES IN CHIPS JOINED BY CONTROLLED COLLAPSE TECHNIQUES
OKTAY, S
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) : 272 - &
[9] SIMONS RE, 1979, Patent No. 4167771
[10] Tomaine L. C., 1978, IBM Technical Disclosure Bulletin, V21, P609