HILLOCK-FREE ALUMINUM THIN FILMS FOR ELECTRONIC DEVICES

[1] ANAND MS, 1967, T METALL SOC AIME, V239, P1848

[2] DIFFUSION OF COPPER IN NICKEL AND ALUMINUM [J]. JOURNAL OF APPLIED PHYSICS, 1965, 36 (12) : 3860 - &

[3] DAHL JM, 1965, J METALS

[4] DOYAMA M, 1964, B AM PHYS SOC, V9, P295

[5] SOLUTE INDUCED GRAIN BOUNDARY HARDENING IN ALUMINUM [J]. SCRIPTA METALLURGICA, 1970, 4 (08): : 641 - &

[6] FRIEDEL J, 1964, DISLOCATIONS, P311

[7] Friedel J., 1964, DISLOCATIONS, P454

[8] HANSEN M, 1968, CONSTITUTION BINARY, P135

[9] HANSEN M, 1964, CONSTITUTION BINARY, P110

[10] RESISTOMETRIC STUDY ON ROLE OF QUENCHED-IN VACANCIES IN AGEING OF AL-CU ALLOYS [J]. ACTA METALLURGICA, 1962, 10 (JUN): : 607 - &

[1] ANAND MS, 1967, T METALL SOC AIME, V239, P1848

[2] DIFFUSION OF COPPER IN NICKEL AND ALUMINUM [J]. JOURNAL OF APPLIED PHYSICS, 1965, 36 (12) : 3860 - &

[3] DAHL JM, 1965, J METALS

[4] DOYAMA M, 1964, B AM PHYS SOC, V9, P295

[5] SOLUTE INDUCED GRAIN BOUNDARY HARDENING IN ALUMINUM [J]. SCRIPTA METALLURGICA, 1970, 4 (08): : 641 - &

[6] FRIEDEL J, 1964, DISLOCATIONS, P311

[7] Friedel J., 1964, DISLOCATIONS, P454

[8] HANSEN M, 1968, CONSTITUTION BINARY, P135

[9] HANSEN M, 1964, CONSTITUTION BINARY, P110

[10] RESISTOMETRIC STUDY ON ROLE OF QUENCHED-IN VACANCIES IN AGEING OF AL-CU ALLOYS [J]. ACTA METALLURGICA, 1962, 10 (JUN): : 607 - &