MECHANISM FOR ALSICU ALLOY CORROSION

被引：9

作者：

ISHIDA, T ^{[1
]}

FUJIWARA, N ^{[1
]}

YONEDA, M ^{[1
]}

NAKAMOTO, K ^{[1
]}

HORIE, K ^{[1
]}

机构：

[1] MITSUBISHI ELECTR CO,KITAITAMI WORKS,ITAMI,HYOGO 664,JAPAN

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1992年 / 31卷 / 6B期

关键词：

PLASMA ETCHING; ASHING; CORROSION; ALUMINUM ETCHING; ALSICU ALLOY; ION-CHROMATOGRAPHY ANALYSIS;

D O I：

10.1143/JJAP.31.2045

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We investigated corrosion at AlSiCu/TiN interconnection tines in VLSI devices. This type of corrosion appeared during the deionized water rinse treatment after the dry etching and ashing treatment (with O2 + CF4 gas mixture). The corrosion shape was "pitlike". When added the vacuum heating treatment before the deionized water rinse, the corrosion number was decreased. However, the ashing treatment had a contrary effect for this type of corrosion suppression. We investigated this type of corrosion mechanism by ion-chromatography analysis. In this analysis, residual Cl concentration decreased when the ashing time was prolonged, but the corrosion number was increased significantly. We measured residual F concentration at the same time, and detected a high concentration of F- ions. We consider that these F- ions contribute to this type of corrosion.

引用

页码：2045 / 2048

页数：4

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[5]

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