REVERSIBLE HILLOCK GROWTH IN THIN FILMS

被引：39

作者：

LAHIRI, SK

WELLS, OC

机构：

[1] IBM Watson Research Center, Yorktown Heights

来源：

APPLIED PHYSICS LETTERS | 1969年 / 15卷 / 07期

关键词：

D O I：

10.1063/1.1652982

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Thin films of lead and aluminum on substrates of lower thermal expansion coefficient were examined using a hot stage in a scanning electron microscope. Hillocks were seen to grow as the temperature was increased and then to shrink as the temperature slowly fell. This effect is thought to be caused by a change from compressive into tensile stress in the film. © 1969 The American Institute of Physics.

引用

页码：234 / &