EFFECT OF LUBRICANT ENVIRONMENTS ON SAW DAMAGE IN SI WAFERS

被引：12

作者：

KUAN, TS ^{[1
]}

SHIH, KK ^{[1
]}

VANVECHTEN, JA ^{[1
]}

WESTDORP, WA ^{[1
]}

机构：

[1] IBM CORP,E FISHKILL FACIL,DIV DATA SYST,HOPEWELL JUNCTION,NY 12533

来源：

关键词：

D O I：

10.1149/1.2129904

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：1387 / 1394

页数：8

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