KINETICS OF ELECTROLESS COPPER PLATING .6. INHIBITION BY ADSORPTION OF LIGAND

被引：15

作者：

DONAHUE, FM

SAJKOWSKI, DJ

BOSIO, AC

SCHAFER, LL

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1982年 / 129卷 / 04期

关键词：

D O I：

10.1149/1.2123957

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：717 / 719

页数：3

共 13 条

[1] ADSORPTION OF NORMAL-DECYLAMINE ON SOLID METAL ELECTRODES [J].

BOCKRIS, JO ;

SWINKELS, DAJ .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1964, 111 (06) :736-743

[2] ADSORPTION OF NAPHTHALENE ON SOLID METAL ELECTRODES [J].

BOCKRIS, JO ;

GREEN, M ;

SWINKELS, DAJ .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1964, 111 (06) :743-748

[3]

Donahue F. M., 1973, PLATING, V60, P135

[4] KINETICS OF ELECTROLESS COPPER PLATING .4. EMPIRICAL RATE LAW FOR H2CO-EDTA BATHS [J].

DONAHUE, FM ;

WONG, KLM ;

BHALLA, R .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (11) :2340-2342

[5]

DONAHUE FM, UNPUB

[6] ELECTROCHEMISTRY OF ELECTROLESS DEPOSITION OF COPPER [J].

ELRAGHY, SM ;

ABOSALAMA, AA .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (02) :171-176

[7]

Goldie W., 1964, PLATING, V51, P1069

[8] COMPLEXES FORMED BETWEEN COPPER(II) ION AND N,N,N',N'-TETRAKIS-(2-HYDROXYPROPYL)-ETHYLENEDIAMINE [J].

HALL, JL ;

JONES, FR ;

DELCHAMPS, CE ;

MCWILLIAMS, CW .

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1957, 79 (13) :3361-3364

[9]

KEYWORTH DA, 1959, TALANTA, V2, P383

[10]

Molenaar A., 1974, PLATING, V61, P238

← 1 2 →