NUMERICAL-SIMULATION OF DIFFUSION IN POLYCRYSTALLINE THIN-FILM COUPLES DURING RECRYSTALLIZATION

被引：2

作者：

EHRMANNFALKENAU, E

WAGENDRISTEL, A

BANGERT, H

机构：

[1] Institut for Applied Physics, Technical University, Vienna

来源：

THIN SOLID FILMS | 1979年 / 57卷 / 01期

关键词：

D O I：

10.1016/0040-6090(79)90416-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Interdiffusion between freshly deposited thin polycrystalline films can occur during an initial recrystallization period when grain boundaries act as moving diffusional short circuits. This type of diffusional mixing is investigated on the basis of computer simulations in thin film couples with identical diffusion properties. It is shown that errors in the grain boundary diffusion coefficients towards lower values arise if the Whipple treatment is applied. © 1979.

引用

页码：109 / 113

页数：5

共 9 条

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