HEAT-TRANSFER IN ELECTRONIC SYSTEMS WITH EMPHASIS ON ASYMMETRIC HEATING

被引：13

作者：

AUNG, W ^{[1
]}

机构：

[1] BELL LABS, MURRAY HILL, NJ 07974 USA

来源：

BELL SYSTEM TECHNICAL JOURNAL | 1973年 / 52卷 / 06期

关键词：

D O I：

10.1002/j.1538-7305.1973.tb01996.x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：907 / 925

页数：19

共 11 条

[1] DEVELOPING LAMINAR FREE CONVECTION BETWEEN VERTICAL FLAT PLATES WITH ASYMMETRIC HEATING
AUNG, W
SERNAS, V
FLETCHER, LS
[J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1972, 15 (11) : 2293 - &
[2] FREE CONVECTION COOLING OF ELECTRONIC SYSTEMS
AUNG, W
KESSLER, TJ
BEITIN, KI
[J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (02): : 75 - 86
[3] FULLY DEVELOPED LAMINAR FREE CONVECTION BETWEEN VERTICAL PLATES HEATED ASYMMETRICALLY
AUNG, W
[J]. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1972, 15 (08) : 1577 - &
[4] AUNG W, ASME72WAHT40 PAP
[5] Bodoia J.R., 1962, ASME J HEAT TRANSF, V84, P40, DOI [10.1115/1.3684288, DOI 10.1115/1.3684288]
[6] BODOIA JR, 1959, THESIS CARNEGIE I TE
[7] Heat dissipation of parallel plates by free convection
Elenbaas, W
[J]. PHYSICA, 1942, 9 : 1 - 28
[8] ENGEL RK, 1967, ASME67HT16 PAP
[9] LAUBER TS, 1966, 3 P INT HEAT TRANSF, P126
[10] Ostrach S., 1954, TN3141 NACA