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INTERFACIAL REACTION IN BIMETALLIC SN-CU THIN-FILMS

被引：20
作者：
FUJIWARA, K
OHTANI, M
ISU, T
NANGO, S
KAWANAKA, R
SHIMIZU, K
机构：
[1] MITSUBISHI ELECT CORP,KITA ITAMI WORKS,ITAMI,HYOGO 664,JAPAN
[2] OSAKA UNIV,INST SCI & IND RES,SUITA,OSAKA 565,JAPAN
来源：
THIN SOLID FILMS | 1980年 / 70卷 / 01期
关键词：
D O I：
10.1016/0040-6090(80)90422-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：153 / 161
页数：9
相关论文
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  • [7] SABBAGH NAJ, 1975, MET FINISH, V0073, P00027
  • [8] QUANTITATIVE AUGER ANALYSIS OF COPPER-NICKEL ALLOY SURFACES AFTER ARGON ION-BOMBARDMENT
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    [J]. SURFACE SCIENCE, 1973, 36 (02) : 817 - 821
  • [9] Tu K. N., 1973, Acta Metallurgica, V21, P347, DOI 10.1016/0001-6160(73)90190-9
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