THERMAL SIMULATION OF TRANSIENTS IN MICROWAVE DEVICES

被引:13
作者
WEBB, PW
RUSSELL, IAD
机构
[1] Univ of Birmingham, Birmingham
来源
IEE PROCEEDINGS-G CIRCUITS DEVICES AND SYSTEMS | 1991年 / 138卷 / 03期
关键词
THERMAL SIMULATION; THERMAL TRANSIENTS; HETEROJUNCTION BIPOLAR TRANSISTORS;
D O I
10.1049/ip-g-2.1991.0056
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The optimal design of solid state microwave power devices, taking thermal and electrical parameters into consideration is a complex subject requiring extensive use of numerical simulation tools. The paper addresses the problem of the thermal simulation of pulsed microwave solid state power sources designed to operate at a particular duty cycle. The electrical design dictates that the device be as small as possible, in conflict with the thermal criteria. The size of the device will increase with increasing duty cycle and the length of each power pulse it is required to handle. A significant factor is the amount of computing resource necessary to simulate the thermal transient for a sufficiently large number of duty cycles so that the device will reach its maximum working temperature. A solution to this problem is presented that requires the combination of one steady state, and one transient simulation, to predict the maximum working temperature for a given duty cycle and any pulse length. A particular heterojunction bipolar transistor (HBT) operated under varying duty cycle is analysed as an example.
引用
收藏
页码:329 / 334
页数:6
相关论文
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