COPPER ALUMINA BOUNDING - EVOLUTION AND MICROSCOPIC CHARACTERIZATION OF COMPOUNDS IN THE INTERFACE REGION

被引：4

作者：

BERAUD, C

ESNOUF, C

机构：

来源：

MICROSCOPY MICROANALYSIS MICROSTRUCTURES | 1990年 / 1卷 / 01期

关键词：

D O I：

10.1051/mmm:019900010106900

中图分类号：

TH742 [显微镜];

学科分类号：

摘要：

引用

页码：69 / 90

页数：22

共 68 条

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