MODELING AND ANALYSIS OF VIAS IN MULTILAYERED INTEGRATED-CIRCUITS

被引：74

作者：

GU, QZ

YANG, YE

TASSOUDJI, MA

机构：

[1] MIT,DEPT ELECT ENGN & COMP SCI,CAMBRIDGE,MA 02139

[2] SHANGHAI INST MECH & ELECT ENGN,DEPT ELECTR ENGN,SHANGHAI,PEOPLES R CHINA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1993年 / 41卷 / 02期

关键词：

D O I：

10.1109/22.216458

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A method for modeling and analyzing vias in multilayered integrated circuits is presented. The model of via structures is constructed based upon microwave network theory. The whole via structure is divided into cascaded subnetworks, including a vertical via passing through different layers and transitions from the microstrip line and/or striplines to the vertical via. The parameters of each subnetwork are obtained from electromagnetic field analysis. Numerical results in the frequency domain and the time domain are presented. Validation of the model has been carried out by both measurements and the FDTD modeling. Comparison to the measurements shows good agreement in the frequency range in which the components of experimental model are within specification, and the time domain simulation results also match well with the FDTD results.

引用

页码：206 / 214

页数：9

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