AN INVESTIGATION OF HARDNESS AND ADHESION OF SPUTTER-DEPOSITED ALUMINUM ON SILICON BY UTILIZING A CONTINUOUS INDENTATION TEST

被引：97

作者：

STONE, D

LAFONTAINE, WR

ALEXOPOULOS, P

WU, TW

LI, CY

机构：

[1] CORNELL UNIV,ITHACA,NY 14853

[2] IBM CORP,ALMADEN RES CTR,SAN JOSE,CA 95192

来源：

JOURNAL OF MATERIALS RESEARCH | 1988年 / 3卷 / 01期

关键词：

D O I：

10.1557/JMR.1988.0141

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：141 / 147

页数：7

共 15 条

[1]

DIETER GE, 1976, MECHANICAL METALLURG, P565

[2] A method for interpreting the data from depth-sensing indentation instruments [J].

Doerner, M. F. ;

Nix, W. D. .

JOURNAL OF MATERIALS RESEARCH, 1986, 1 (04) :601-609

[3] Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques [J].

Doerner, M. F. ;

Gardner, D. S. ;

Nix, W. D. .

JOURNAL OF MATERIALS RESEARCH, 1986, 1 (06) :845-851

[4] INDENTATION-DEBONDING OF AN ADHERED SURFACE-LAYER [J].

ENGEL, PA ;

ROSHON, DD .

JOURNAL OF ADHESION, 1979, 10 (03) :237-253

[5]

HALL EO, 1961, P PHYS SOC LONDON B, V643, P747

[6]

HANNULA SP, 1985, P MATERIALS RES SOC, V40, P217

[7] A KINEMATIC SOLUTION FOR PLANE-STRAIN INDENTATION OF A BILAYER [J].

LEBOUVIER, D ;

GILORMINI, P ;

FELDER, E .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1985, 18 (02) :199-210

[8]

LOUBET JL, 1986, ASTM STP, V889, P72

[9]

Marshall D.B., 1986, MICROINDENTATION TEC, P26

[10]

Mott BW, 1957, MICROINDENTATION HAR

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