ENHANCED ELECTROCHEMICAL DEPOSITION WITH AN ATOMIC-FORCE MICROSCOPE

被引:51
作者
LAGRAFF, JR
GEWIRTH, AA
机构
[1] UNIV ILLINOIS, DEPT CHEM, URBANA, IL 61801 USA
[2] UNIV ILLINOIS, MAT RES LAB, URBANA, IL 61801 USA
关键词
D O I
10.1021/j100095a003
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In-situ atomic force microscopy (AFM) is shown to locally enhance the electrochemical deposition of copper (Cu) onto single-crystal Cu surfaces. The tip-sample interaction increases the growth rate of Cu, resulting in the localized formation of nanometer scale epitaxial deposits. The results are consistent with a heterogeneous nucleation and growth mechanism in which the tip-sample interaction creates surface defect sites in a passivating layer which are active toward the electrochemical adsorption of Cu species. This protection-deprotection scheme enables precise control of feature sizes and allows this technique to be used for fabrication and constructive modification of solid-liquid interfaces.
引用
收藏
页码:11246 / 11250
页数:5
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